3D Plus and Edgewood Ventures announce the signature of a Licensing agreement for the production of 3D electronic modules with Hindustan Aeronautics Limited (HAL) in India.
3D PLUS is the leading company for 3D electronics packaging in Europe thanks to its patented stacking technology for the delivery of high density – high reliability products. The agreement allows HAL to use 3D PLUS technology and know how against payment of royalties in order to produce and sell modules in India and several other regions.
3D PLUS will assist HAL in setting up, qualify and operate an assembly line in the Bangalore and transfer the necessary know how for the design, manufacture and test of aerospace grade products.
Announcing the partnership with Edgewood Venture, Christian Val, President of 3D PLUS stated: “With this strategic agreement we will be able to expand a business where we already had strong sales thanks to our local agent”.
The design and manufacture of high density Systems in a Package (calculation cores, stacked memory) lead to significant reductions in size (75%), and weight (80%), improvements in speed, robustness, time to market and ultimately costs.
Major applications are in the field of space (satellites), aviation (avionics, flight recorders) but also in harsh environments like automotive or oil drilling.
ABOUT 3D PLUS COMPANY:
Founded in 1996 as a spin-off of Thales, 3D Plus has become a worldwide actor for the advanced high density 3D package and die stacking technology meeting the demand for high reliability, extreme performance and very small size electronics.
Its portfolio of patented and very advanced stacking technologies starts with Package scale upward to chip-size and wafer-level packaging techniques and provides leading edge, highly integrated and rugged modules embedding Active, Passive, Opto-electronics and MEMS/MOEMS components.
With a broad range of catalogue products including memory modules, camera heads, power converters and computer modules, with its very miniaturized System-In-Package solutions and by Licensing its technologies, 3D PLUS meets the requirements of high technology industries in industrial, telecom., computer/blade server, military, avionics, medical and space markets.
