3D Plus will attend the 2006 IEEE Nuclear and Space Radiation Effects Conference (NSREC) in Ponte Vedra Beach, Florida, USA on July 17-21, 2006.
This annual meeting of engineers and scientists presents the latest techniques for enhancing the performance of microelectronic devices and circuits that are used in radiation environments.
3D Plus is the leading company for the 3-D packaged electronics and is recognized as a high performance innovator in the design and manufacturing of miniaturized 3-D modules according to its patented vertical stacking technology for more than 10 years.
3D Plus fits the requirements of high technology and high reliability industries in military, avionics, medical and space markets.
