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Master Bond Adhesive Manufacturer for the Aerospace Industry

Master Bond is at the forefront of new product development to meet the ever-increasing stringent specifications of the aerospace industry. Our product line of epoxies, polyurethanes, silicones, and polysulfides showcases a wide variety of performance properties to meet every application. These include electrically insulative, thermally conductive, electrically conductive, high-temperature, vibration, and chemically resistant grades. Products are available in liquids, pastes, and films / preforms.

NASA-compliant outgassing systems

Master Bond offers many systems that are cryogenically serviceable, and meet the requirements of UL94V-0 testing for flame retardancy. We also offer low outgassing systems that exceed the demanding ASM E595-84 test standards accepted by NASA for space applications. These aerospace systems offer superior quality, long-term durability and outstanding performance in the most hostile environmental conditions.

High-temperature resistant adhesives for aerospace engineers

Extensive research has led to the introduction of innovative formulations with improved capabilities. Most noteworthy are compounds that have higher thermal conductivity, heat resistance up to 600°F and superior transparency. Special emphasis has been placed in finding enhanced processing solutions for composite assembly applications. Master Bond continues to work with material suppliers and research institutions to utilize the most advanced polymeric materials.

Aerospace epoxy applications

Master Bond adhesive grades are designed to meet many important aerospace performance requirements. Key properties are abrasion resistance, excellent adhesion, impact resistance, high peel strength, dimensional stability, optical transmission, low coefficient of expansion, low shrinkage, low stress, low volume resistivity, durability, resistant to water, shock and vibration.

From prototype to assembly to repair and maintenance, a laundry list of potential applications for Master Bond adhesives exists in the aerospace industry. Examples include (but are not limited to) sealing doors, ports, hatches flight control surfaces and fiberglass composites. Other examples are acoustic insulation for floor isolators, rod ends, tuned vibration absorbers (TVAs), and vibration dampening muffler systems.

Structural applications for frames, reinforcement, turbines, rotor blades, laminating, bonding metal and fiber-reinforced composites and structural panels are also relevant. Bonding, braking systems, galleys, seats and audio/visual systems are some other examples of uses for epoxy adhesives. Applications for assembly, repair, and maintenance must take into account conditions for high-temperature, thermal conductivity, vibration, shock, impact and chemical protection.

Microelectronic adhesives and sealants

We manufacture the widest variety of microelectronic adhesives / sealants / coatings for high-performance aerospace applications. These compounds include conformal coatings, potting / encapsulation compounds, flip chip underfills, glob tops and die attach adhesives. Our systems have earned a well-deserved reputation for high reliability, ease of application and long-term performance upon exposure to extreme environments.

Heat-cured epoxy

Supreme 10HTS, a silver-filled system with excellent electrical conductivity and high physical strength properties, is a one-part, heat-cured (250°F-300°F) epoxy. Serviceable from cryogenic temperatures up to 400°F, it meets NASA low outgassing specifications and can be applied without sagging or dripping, even on vertical surfaces.

Temperature-resistant epoxy

For a two-part, fast-setting (3-5 minutes in 10gm-20gm masses), room temperature curable epoxy, we offer EP65HT-1. High temperature resistance up to 400°F, it features a glass transition temperature over 125°C and is also NASA low outgassing approved.

Two-part flexibilized epoxy

Master Bond’s two-part, room temperature curing, flexibilized epoxy EP37-3FLF, is an easy to apply, low-viscosity system. It has excellent dampening properties and a convenient 1:1 mix ratio.

Master Bond provides one-on-one personal technical support and will recommend the product that will optimally match the specific design requirements of any aerospace application.

Epoxy film adhesives and preforms

Enhance productivity yields, simplify handling, save time, and reduce waste with Master Bond epoxy films and preforms. These formulations include electrically conductive and thermally conductive compounds, as well as compositions with both thermal and electrical insulation properties.

Particularly desirable characteristics include long storage even at ambient temperatures, fast cures at moderately elevated temperatures, high adhesive strength, and excellent chemical resistance. Controllable flow enhances processing ease. The cured epoxy products offer excellent bond strength to both similar and dissimilar substrates, plus high moisture and chemical resistance.

Successful industry applications include substrate attachment with minimal squeeze out, heat sink bonding, lid sealing, stress absorption, hybrids, connectors, and other electronic assemblies.

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Press Release

Master Bond Optically Clear Epoxy Cures at Room Temperature and Withstands Cryogenic Conditions

For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a su

Master Bond Inc.

154 Hobart Street

Hackensack, NJ 07601


United States of America

+1 201 343 8983 +1 201 343 2132

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Press Release

24 March 2011

For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy has exceptional resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a su

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2 March 2011

For applications demanding exceptional chemical resistance, especially to acids, fuels, and oils, Master Bond has developed EP21AR. Whether coating, lining, bonding or sealing, this two-component epoxy can withstand harsh, acidic environments, including prolonged immersion in 96%-98% sulphuric ac

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8 February 2011

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for Nasa low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cure

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18 January 2011

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety

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14 December 2010

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22BTU/in/ft²/hr/°F and serviceability from -60

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Regional Offices

Master Bond Inc.

154 Hobart Street

Hackensack, NJ 07601


United States of America

Agnes Brenson +1 201 343 8983 +1 201 343 2132

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