Aircraft Electronic Modules in 3D Component Packaging
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3D Plus Receives the 2007 EUREKA Lynx Award
3D Plus has received the 2007 EUREKA Lynx Award for outstanding technological and commercial achievement. This trophy is awarded by the highly successful EUREKA WALPACK project, which...
3D Plus and Edgewood Ventures Announce the Signing of Major Licensing Agreement
3D Plus and Edgewood Ventures announce the signature of a Licensing agreement for the production of 3D electronic modules with Hindustan Aeronautics Limited (HAL) in India. 3D PLUS is...
3D Plus Announce Strategic Partnership with BAE Systems
BAE Systems has entered into a strategic partnership with 3D Plus, the leading company for 3D electronics packaging in Europe, to deliver bespoke 3D System-In-Package solutions enabling...
Successful Renewal of 3D PLUS ESA Certificate
3D Plus is pleased to announce the successful renewal of its ESA Capability Approval Certificate for Space Applications. From September 2006, several inspections and product technology...
3D Plus at the IEEE Nuclear and Space Radiation Effects Conference 2006
3D Plus will attend the 2006 IEEE Nuclear and Space Radiation Effects Conference (NSREC) in Ponte Vedra Beach, Florida, USA on July 17-21, 2006. This annual meeting of engineers and...